MC 2023 Darmstadt
You are cordially invited to join us at Microscopy Conference 2023, taking place in Darmstadt from February 27th to March 2nd, where TESCAN is a proud diamond sponsor
The TESCAN Global Team is excited to meet you. We have added our staff's personal participation, scientific presentations, and various demo opportunities to the event's agenda.
Highlights you’ll see at TESCAN’s booth #E0-1 during the conference include:
- A demo of our newly released TENSOR 4D-STEM, designed to address the needs of anyone with an interest in multimodal nano-characterization applications (morphological, chemical, and structural), including materials scientists, semiconductor R&D and failure analysis engineers, and crystallographers;
- The TESCAN UniTOM HR will be showcased, a versatile micro-CT system that combines high spatial resolution with high temporal resolution that is optimized for static and dynamic imaging, fulfilling all of the necessary imaging requirements;
- Learn about our Battery Research Analytical Workflow, by leveraging a unique combination of high current FIB, field-free UHR SEM, and integrated TOF-SIMS,
In-booth agenda - register for a demo
TESCAN TENSOR
Experience an exclusive TENSOR demo. The first near-UHV 4D-STEM at booth E1-24.
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TESCAN TENSOR
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TESCAN AMBER with Glove Box
Explore with us how TESCAN AMBER with TOF-SIMS is crucial for battery research at the E0-1 booth.
TESCAN AMBER with Glove Box
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Learn with us
Resolution, Speed, Image Quality, and System Versatility in micro-CT
Despite an ever-expanding range of additional capabilities for micro-CT systems, the key application for micro-CT remains the production of 3D datasets of a sample’s structure or composition. Whether these datasets are used to quantify material characteristics such as porosity, used as input for numerical models, or are simply being used to gain a better understanding of the interior of a sample, image quality remains paramount to obtaining reliable and reproducible results.
CryoTEM sample preparation by FIB-SEM
Cryo-electron tomography (cryo-ET) has become an established technique within structural biology for observing and characterizing biological samples in their close-to-native state on a molecular level. Cryo-ET provides an unparalleled level of structural detail. However, it requires a specimen thin enough (typically less than 200nm) to allow an electron beam to pass through it. Current state-of-the-art sample preparation methods use Focused Ion Beam (FIB) milling to achieve this. FIBs using a Gallium ion source are already widely used in the scientific community. These types of instruments offer unprecedented resolution and precise milling but accurate sample preparation is time consuming creating a bottleneck which often limits the overall throughput.
Micro CT
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TESCAN TENSOR: The Integrated, Precession-Assisted, Analytical 4D-STEM
Micro CT
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3D tomography of large volumes
Traditional techniques in cell and tissue microscopy can provide information about details hidden under the surface of cells and tissues. However, this information is typically two-dimensional and lacks context. Current techniques are shifting towards a more holistic approach, that combines X-ray micro-computed tomography (µCT) and electron microscopy to reveal morphological and ultrastructural information ranging from the structure of whole organisms and tissues down to the sub-cellular details.
Micro CT
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The role of Electron Microscopy and Focused ion beam characterization methods in the evaluation of electrochemical materials and their interphases
Micro CT
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Achieve the highest quality and throughput in TEM lamella preparation using TESCANs automation and unique lift out method
Micro CT
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Scientific talk
Faster mm-scale defect/failure analysis by combining plasma FIB milling and Laser Ablation
Micro CT
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Our speakers
Jakub Javurek is a Product Marketing Manager for 2D & 3D Cell and Tissue Characterization. His primary focus was on SEM and FIB-SEM analyses of sensitive biological materials.
- 3D tomography of large volumes
- Tuesday 28 at 12:45
- Mini LL Chromium, level 2
- 60 mins, 90 pax
Martin Sláma works as a Product Marketing Manager for FIB-SEM 3D characterization and TEM lamella preparation in Materials science with over 6 years of experience working with the FIB-SEM instruments.
- Achieve the highest quality and througput in TEM lamella preparation using TESCANs automation and unique lift out method
- Wednesday March 1 at 12:00
- Chromium (level 2)
- 60 mins, 90 pax
Lars-Oliver Kautschor is sales development manager for TESCAN’s Micro-CT product lines. He has over 10 years of experience in the field of X-ray microscopy and Micro-CT industries.
- Resolution, Speed, Image Quality, and System Versatility in micro-CT
- Monday February 27 at 12:45
- LL Copernicum, level 0
- 60 mins, 250 pax
Dirk van der Wal is Chief Marketing Officer at TESCAN Orsay Holding a.s. He had held application specialist, product management, and product marketing roles at different companies in the Electron Microscopy industry.
- TESCAN TENSOR: The Integrated, Precession-Assisted, Analytical 4D-STEM
- Tuesday February 28 at 12:45
- Spectrum A (level 1)
- 60 mins, 800 pax
In 2016, Ondrej joined TESCAN as Global Applications Director. Since January 2019 he works as Product Marketing Director for the Life Sciences segment.
- CryoTEM sample preparation by FIB-SEM
- Tuesday 27 at 12:45
- Mini LL Chromium, level 2
- 60 mins, 90 pax
Tomáš is with TESCAN since 2009. He has a background in nanotechnology, nanoprototyping by use of electron or ion beam-based lithography methods and ToF-SIMS technique.
- The role of Electron Microscopy and Focused ion beam characterization methods in the evaluation of electrochemical materials and their interphases
- Wednesday 1 at 12:45
- LL Copernicum, level 0
- 60 mins, 250 pax
Petr Klímek is a Product Marketing Director at TESCAN ORSAY HOLDING in Brno, Czech Republic. His previous positions—Application Specialist and Product Manager for TESCAN SEMs—provided him with substantial insight into electron microscopy, its applications, and its overall benefits for various microanalytical tasks.
- Faster mm-scale defect/failure analysis by combining plasma FIB milling and Laser Ablation
- Tuesday February 28 at 18:45
- Copernicum (level 0)
- 20 mins, 250 pax